Altius Key Features Minimum grid-array pitch of 45 μm Ultra-low probe force for direct probing on copper through silicon vias or solder microbumps, ~1 gram per probe at operating overtravel with best-in-class contact resistance stability Support for HBM known-good-die or known-good-stack test, >=3 Gbps test speed Scalable for multi-site test to increase throughput, X4 capable for HBM Configurable with Hybrid MEMS probes for mixed-pitch microbump layout
